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MBOA Ultrawideband TechZone Showcases UWB Products And Applications At CES (22/12/2004)

Sixteen companies, four industry associations, eight demonstrations show high-speed wireless technology and future of UWB

Sixteen of the world's leading semiconductor, personal computing and consumer electronics companies along with four key wireless industry organizations will appear together in the MultiBand OFDM Alliance (MBOA) Ultrawideband TechZone in the Innovations Plus area of the 2005 International Consumer Electronics Show (CES), Jan. 6-9, in Las Vegas. The intent of this cooperative appearance is to excite and educate the CES audience about ultrawideband (UWB), a revolutionary high-speed, short-range wireless technology with enormous potential for consumer electronics slated for release as early as the second half of 2005.

The TechZone will also show the broad industry support for MBOA ultrawideband technology.

"By collaborating today, the 170-plus members of the MBOA-SIG together with the WiMedia Alliance, Wireless USB Promoter Group and 1394 Trade Association are demonstrating a high degree of broad industry commitment and cooperation for the MBOA UWB technology," said Stephen Wood, technology strategist for Intel R&D and a member of the MBOA-SIG promoter group. "This industry convergence around a single technology helps to ensure seamless interoperability between future products and will fuel the creation of a robust and fast-growing market."

The MBOA Ultrawideband TechZone will include eight live demonstrations of the wireless technology including bulk data transfers, quality-of-service based streaming video from various sources using wireless USB and wireless IP approaches.

The exhibiting companies in the TechZone will include: Alereon, Commstack, Focus Enhancement Semiconductors, General Atomics Advanced Wireless Group, HP, Intel Corporation, Mitsubishi Electric, Orangeware, Philips Electronics, Staccato Communications, Samsung Electronics, Texas Instruments, Taiyo Yuden R&D of America (TRDA), TDK, WiQuest and Wisair.

The exhibiting specification-building bodies, who are closely working together to ensure interoperability for MB-OFDM ultrawideband products, will include: the MultiBand OFDM Alliance (MBOA-SIG), WiMedia Alliance, 1394 Trade Association and the Wireless USB Promoter Group.

www.multibandofdm.org